加工優(yōu)勢
1. 一體模塊化設(shè)計，方便維修，體積小巧
2. 材料環(huán)保，符合ROHS標(biāo)準(zhǔn)
3. 屬于冷光源，加工熱影響小，適合敏感材料深加工
4. 光斑直徑最小可達15UM，適用薄片微孔鉆孔加工
5. 激光器2萬小時免費維護，無耗材，省電節(jié)能
6. 軟件界面人性化，操作簡單易學(xué)，編輯功能強大
7. 具有更窄的脈沖寬度和更高的峰值功率
8. 加工效果好，打標(biāo)速度快，可實現(xiàn)超精細激光打標(biāo)
ADVANTAGES
1. Integrated modular design, easy maintenance, compact size
2. Material environmental protection, in line with ROHS standards.
3. It belongs to cold light source and has little heat effect on processing. It is suitable for deep processing of sensitive materials.
4. The smallest spot diameter can reach 15UM, which is suitable for thin slice micro-hole drilling.
5. Laser maintenance-free for 20000hours, no consumables, power saving and energy saving
6. Convenient data processing with dedicated laser marking software. Interface is simple and friendly, easy operation.
7. With narrower pulse width and higher peak power.
8. It has good processing effect, fast marking speed, and can realize ultra-fine laser marking.
規(guī)格參數(shù) SPECIFICATION:
應(yīng)用范圍 APPLICATIONS：
主要應(yīng)用于超精細加工的高端市場，化妝品、藥品，飾品及其他高分子材料的包裝瓶表面打標(biāo)，效果精細，標(biāo)記清晰牢固，優(yōu)于油墨噴碼且無污染；柔性PCB板打標(biāo)、劃片；
硅晶圓片微孔、盲孔加工；LCD液晶玻璃二維碼打標(biāo)、玻璃器具表面打孔、金屬表面鍍層打標(biāo)、塑膠按鍵、電子元件、禮品、通訊器材、建筑材料。
It is mainly used in the high-end market of ultra-fine processing. The surface marking of packaging bottles of cosmetics, medicines, ornaments and other polymer materials is fine, clear and firm, better than ink printing and pollution-free.
It is also suitable for marking and scribing of flexible PCB, silicon wafer microhole, blind hole processing, LCD glass QRcode marking, glass surface drilling, metal surface coating marking, plastic keys, electronic components, gifts, communication equipment, building materials.
加工效果EFFECTS
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